Item | Capability |
Material Brand | Shengyi，TUC，EMC，ITEQ，Boyu，NanYA，KB |
Layer Count | 1- 28 layers; HDI 2+N+2 |
Laminate Material | FR-4，High TG，High CTI，High Frequency，Aluminum Base , Copper Base |
Finished Board Thickness | 0.4 - 4.0mm (16 - 158 mil) |
Max. Panel Size | 520*1200mm |
Outline Tolerance | ± 0.10mm |
Min. Line Width/Spacing | 2.5mil (0.064mm)/2.5mil (0.064mm) |
Impedance Control | +/- 8% ohm |
Min. BGA PAD Size | 8mil |
Min. Spacing between BGA PAD and Track | 3.0mil |
Min. Spacing between Hole and Innerlayer Track | 6mil |
Hole Copper Thickness | Automotive PCB: Min.25um； Others：Avg.25um Min.20um（IPC-III） |
Surface Copper Thickness | 18um，35um，70um，105um，140um，175um (0.5oz – 5oz) |
Min. Drilling Hole | Mechanical Drilling: 0.15mm (6mil); Laser Drilling: 0.1mm(4mil) |
Max. Aspect Ratio | 12:1(Hole>0.30mm); 10:1(Hole≤0.30mm) |
Soldermask Color | Green, Blue, Black, White, Yellow, Red, etc. |
Min. Soldermask Dam | 0.076mm(3mil) |
Surface Finish | Immersion Gold，OSP，HASL，LF HASL，Immersion Silver，Immersion Tin，Gold Plating |
